{"id":256330,"date":"2026-05-26T19:00:00","date_gmt":"2026-05-26T23:00:00","guid":{"rendered":"https:\/\/news-you-need.com\/index.php\/2026\/05\/26\/usi-showcases-advanced-sic-chip-embedded-packaging-technology-at-pcim-europe-2026\/"},"modified":"2026-05-26T19:20:09","modified_gmt":"2026-05-26T23:20:09","slug":"usi-showcases-advanced-sic-chip-embedded-packaging-technology-at-pcim-europe-2026","status":"publish","type":"post","link":"https:\/\/news-you-need.com\/index.php\/2026\/05\/26\/usi-showcases-advanced-sic-chip-embedded-packaging-technology-at-pcim-europe-2026\/","title":{"rendered":"USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026"},"content":{"rendered":"<p><a href=\"https:\/\/www.prnewswire.com\/apac\/news-releases\/usi-showcases-advanced-sic-chip-embedded-packaging-technology-at-pcim-europe-2026-302781452.html\">USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026<\/a><\/p>\n<p><a href=\"https:\/\/www.prnewswire.com\/apac\/news-releases\/usi-showcases-advanced-sic-chip-embedded-packaging-technology-at-pcim-europe-2026-302781452.html\">https:\/\/www.prnewswire.com\/apac\/news-releases\/usi-showcases-advanced-sic-chip-embedded-packaging-technology-at-pcim-europe-2026-302781452.html<\/a><\/p>\n<p>Publish Date: <a href=\"publish_date]\">2026-05-26 19:00:00<\/a><\/p>\n<p>Source Domain: <a href=\"www.prnewswire.com\">www.prnewswire.com<\/a><\/p>\n<p class=\"prntac\">~ Enabling Next-Generation Power Solutions ~<\/p>\n<p><span class=\"legendSpanClass\">SHANGHAI<\/span>, <span class=\"legendSpanClass\">May 27, 2026<\/span> \/PRNewswire\/ &#8212; USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carbide (SiC) dies into multilayer ABF substrates and adopted Single-Side Copper Exposed (SSC) module packaging technology to integrate ceramic substrate insulation and wire-bondless architecture within industry-standard power packages.<\/p>\n<p>          <img title=\"USI Power Module \u2013 Chip Embedded SiC Substrate\" data-getimg=\"https:\/\/mma.prnewswire.com\/media\/2987496\/image1.jpg?w=500\" id=\"imageid_2\" alt=\"USI Power Module \u2013 Chip Embedded SiC Substrate\" class=\"gallery-thumb img-responsive\" rel=\"newsImage\" itemprop=\"contentUrl\" loading=\"lazy\"\/><br \/>\n          <span class=\"fa fa-arrows-alt arrow_styles\" aria-hidden=\"true\"\/><\/p>\n<p>        USI Power Module \u2013 Chip Embedded SiC Substrate<\/p>\n<p>The innovative design marks a significant advancement in internally insulated power discrete devices by enabling the package itself to deliver built-in electrical insulation while simultaneously achieving low stray inductance and minimal conduction resistance. Designed to address the growing industry demand for higher efficiency, superior thermal performance, and greater power density, USI&#8217;s chip-embedded module packaging technology dramatically reduces conduction loss, lowers heat generation, and improves long-term operational reliability compared with conventional packaging approaches. By integrating a ceramic substrate, the package body provides reliable electrical insulation without the need for additional isolation structures. Meanwhile, the wire-bondless architecture enables larger chip integration within a slim package footprint, further enhancing power density and&#8230;<\/p>\n<p><a href=\"https:\/\/www.prnewswire.com\/apac\/news-releases\/usi-showcases-advanced-sic-chip-embedded-packaging-technology-at-pcim-europe-2026-302781452.html\">Source<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 https:\/\/www.prnewswire.com\/apac\/news-releases\/usi-showcases-advanced-sic-chip-embedded-packaging-technology-at-pcim-europe-2026-302781452.html Publish Date: 2026-05-26&#8230;<\/p>\n","protected":false},"author":1,"featured_media":256332,"comment_status":"closed","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"fifu_image_url":"https:\/\/mma.prnewswire.com\/media\/2987496\/image1.jpg?p=facebook","fifu_image_alt":"","footnotes":""},"categories":[8],"tags":[],"class_list":["post-256330","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technology"],"_links":{"self":[{"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/posts\/256330"}],"collection":[{"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/comments?post=256330"}],"version-history":[{"count":1,"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/posts\/256330\/revisions"}],"predecessor-version":[{"id":256333,"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/posts\/256330\/revisions\/256333"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/media\/256332"}],"wp:attachment":[{"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/media?parent=256330"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/categories?post=256330"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/tags?post=256330"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}