{"id":255191,"date":"2026-05-25T13:02:00","date_gmt":"2026-05-25T17:02:00","guid":{"rendered":"https:\/\/news-you-need.com\/index.php\/2026\/05\/25\/huawei-announces-1-4-nm-chipmaking-technology-to-compete-with-tsmc\/"},"modified":"2026-05-25T15:50:23","modified_gmt":"2026-05-25T19:50:23","slug":"huawei-announces-1-4-nm-chipmaking-technology-to-compete-with-tsmc","status":"publish","type":"post","link":"https:\/\/news-you-need.com\/index.php\/2026\/05\/25\/huawei-announces-1-4-nm-chipmaking-technology-to-compete-with-tsmc\/","title":{"rendered":"Huawei announces 1.4 nm chipmaking technology to compete with TSMC"},"content":{"rendered":"<p><a href=\"https:\/\/www.notebookcheck.net\/Huawei-announces-1-4-nm-chipmaking-technology-to-compete-with-TSMC.1305174.0.html\">Huawei announces 1.4 nm chipmaking technology to compete with TSMC<\/a><\/p>\n<p><a href=\"https:\/\/www.notebookcheck.net\/Huawei-announces-1-4-nm-chipmaking-technology-to-compete-with-TSMC.1305174.0.html\">https:\/\/www.notebookcheck.net\/Huawei-announces-1-4-nm-chipmaking-technology-to-compete-with-TSMC.1305174.0.html<\/a><\/p>\n<p>Publish Date: <a href=\"publish_date]\">2026-05-25 13:02:00<\/a><\/p>\n<p>Source Domain: <a href=\"www.notebookcheck.net\">www.notebookcheck.net<\/a><\/p>\n<p class=\"bodytext\">In the current year, SMIC, China\u2019s leading semiconductor manufacturing foundry, is more than a few nodes behind TSMC, Samsung Foundry and Intel. That difference is here to stay for a while, but not for long. Huawei has announced it plans to compete with TSMC\u2019s 1.4 nm node in 2031. It will still be a generation or so behind, but it should be enough to keep China\u2019s tech ecosystem competitive with its Western counterparts.\n<\/p>\n<p class=\"bodytext\">Huawei plans to employ what it calls \u2018logic folding\u2019 tech to pull off the feat. Logic folding improves upon existing 3D stacking tech by stacking two chips on top of each other. As a result, one gets more transistor density in the same die area without the need for smaller patterning, which would involve the use of EUV tools, something that China doesn\u2019t have, at least in the present. Huawei says the next-gen Kirin 2026 will be one of the first commercially available chips to employ logic folding.\n<\/p>\n<p class=\"bodytext\">However, China has supposedly built a somewhat functional EUV machine with the help of ex-ASML engineers. It isn\u2019t functional now, but should be by 2031. This, combined with Huawei&#8217;s existing efforts to breach the 2 nm barrier with tech like SAQP (self-aligned quadruple pattering), should allow Huawei and SMIC to breach the 5 nm barrier, resulting in even denser silicon.\n<\/p>\n<p class=\"bodytext\">Interestingly, Huawei hasn\u2019t addressed the elephant in the room: cooling. Stacking multiple chips on top of each other will produce a lot more heat than conventional designs. Of course, it is far too early to speculate about the tech in general. Huawei has five years to iron out process inefficiencies, and at the rate at which it has progressed, it should be more than enough.\u00a0<\/p>\n<p>Anil Ganti &#8211; Senior Tech Writer <span title=\"2913\u00a0\"> &#8211; 2913 articles published on Notebookcheck<\/span> since 2019<\/p>\n<p>I&#8217;ve been an avid PC gamer since the age of 8. My passion for gaming eventually pushed me towards general tech, and I got my first writing gig at the age of 19. I have a degree in mechanical engineering&#8230;<\/p>\n<p><a href=\"https:\/\/www.notebookcheck.net\/Huawei-announces-1-4-nm-chipmaking-technology-to-compete-with-TSMC.1305174.0.html\">Source<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Huawei announces 1.4 nm chipmaking technology to compete with TSMC https:\/\/www.notebookcheck.net\/Huawei-announces-1-4-nm-chipmaking-technology-to-compete-with-TSMC.1305174.0.html Publish Date: 2026-05-25 13:02:00&#8230;<\/p>\n","protected":false},"author":1,"featured_media":255192,"comment_status":"closed","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"fifu_image_url":"https:\/\/www.notebookcheck.net\/fileadmin\/Notebooks\/News\/_nc5\/Huawei-1.4-nm.png","fifu_image_alt":"","footnotes":""},"categories":[8],"tags":[30],"class_list":["post-255191","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technology","tag-breach"],"_links":{"self":[{"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/posts\/255191"}],"collection":[{"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/comments?post=255191"}],"version-history":[{"count":1,"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/posts\/255191\/revisions"}],"predecessor-version":[{"id":255193,"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/posts\/255191\/revisions\/255193"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/media\/255192"}],"wp:attachment":[{"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/media?parent=255191"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/categories?post=255191"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news-you-need.com\/index.php\/wp-json\/wp\/v2\/tags?post=255191"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}