Apple’s foldable might be the best-ever iPhone for gaming, reveals unexpected leak
Apple’s foldable might be the best-ever iPhone for gaming, reveals unexpected leak
Publish Date: 2026-06-01 14:22:00
Source Domain: www.notebookcheck.net
ⓘ MajinBu – edited
iPhone Ultra/Fold design model.
Apple’s first foldable “iPhone Ultra” is said to feature advanced vapor chamber cooling for superior thermal management, according to a new leak. Despite ongoing manufacturing challenges with surface-mount technology, the device remains on track for a September 2026 launch alongside the iPhone 18 series.
After seeing our first leaked design model hands-on video of Apple’s upcoming foldable iPhone Ultra, we are now learning that the phone will reportedly feature a sophisticated vapor chamber (VC) cooling system.
Despite the rumors of an ultra-slim 4.5mm profile, a fresh report from a top leakster indicates that Apple is prioritizing high-end thermal engineering, with the leaker describing the device’s thermal performance as “quite impressive”.
This is the first time a reliable source has hinted at a vapor chamber cooling system for the foldable iPhone. For reference, the similarly thin iPhone Air does not utilize this technology. To accommodate the rumored 4.5mm thickness, the device is expected to omit several standard iPhone features, including Face ID, MagSafe, and a physical SIM slot, with Touch ID serving as the biometric authentication.
ⓘ Apple
iPhone 17 Pro, vapor champer cooling design.
Vapor chamber cooling coming to the super-thin foldable iPhone Ultra, reveals surprising leak from a reliable source
The VC cooling system is expected to mirror the design first introduced in the iPhone 17 Pro, which circulates deionized water to distribute heat across the chassis. This move suggests that Apple might really be going all out to ensure the A20 Pro-powered foldable can maintain sustained performance despite its compact internal volume.
While the cooling solution might indeed be on the way, the iPhone Ultra continues to face manufacturing challenges. Reports suggest that pre-assembly stages, specifically regarding surface-mount technology (SMT), are proving difficult to scale.
